The grinding liquid is divided according to its mechanism of action: mechanical action grinding liquid, chemical mechanical action grinding liquid.
Mechanical grinding liquid: diamond, B4C, etc. are used as abrasives, dispersed into the liquid medium by adding dispersants, etc., to form a liquid with grinding effect, called diamond grinding liquid, boron carbide grinding liquid, etc. The abrasive is distributed freely in the dispersion liquid, and the grinding and thinning of the workpiece is realized by using the principle that the hardness of the abrasive is greater than that of the workpiece to be ground. According to the surface of the abrasive, the size of the particles, the configuration of the grinding liquid, the stability of the grinding equipment, etc., after the grinding is completed, large or small scratches are easy to be left on the surface of the workpiece. Therefore, mechanically acting abrasives are generally used for rough grinding, followed by precision grinding and polishing.
Chemical-mechanical grinding fluid: Chemical-mechanical grinding fluid utilizes the principle of "soft grinding and hardening" in wear, that is, polishing with softer materials to achieve a high-quality polished surface. It is a combination of mechanical grinding and chemical corrosion. It forms a smooth and flat surface on the surface of the ground medium by means of the grinding action and chemical corrosion action of ultrafine particles. Therefore, chemical mechanical polishing fluid is also called chemical mechanical polishing fluid (Chemical Mechanical Polishing, referred to as CMP). In the presence of a certain pressure and polishing slurry, the workpiece to be polished moves relative to the polishing pad, and a smooth surface is formed on the surface of the polished workpiece by means of the organic combination of the grinding effect of nanoparticles and the corrosion effect of the oxidant.
